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CVE-2023-33063 Detail

Description

Memory corruption in DSP Services during a remote call from HLOS to DSP.


Metrics

NVD enrichment efforts reference publicly available information to associate vector strings. CVSS information contributed by other sources is also displayed.
CVSS 4.0 Severity and Vector Strings:

NIST CVSS score
NIST: NVD
N/A
NVD assessment not yet provided.

References to Advisories, Solutions, and Tools

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Hyperlink Resource
https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin Patch  Vendor Advisory 
https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin Patch  Vendor Advisory 

This CVE is in CISA's Known Exploited Vulnerabilities Catalog

Reference CISA's BOD 22-01 and Known Exploited Vulnerabilities Catalog for further guidance and requirements.

Vulnerability Name Date Added Due Date Required Action
Qualcomm Multiple Chipsets Use-After-Free Vulnerability 12/05/2023 12/26/2023 Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Weakness Enumeration

CWE-ID CWE Name Source
CWE-416 Use After Free cwe source acceptance level NIST   Qualcomm, Inc.  

Known Affected Software Configurations Switch to CPE 2.2

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Change History

7 change records found show changes

Quick Info

CVE Dictionary Entry:
CVE-2023-33063
NVD Published Date:
12/04/2023
NVD Last Modified:
11/21/2024
Source:
Qualcomm, Inc.