CVE-2020-11154 Detail
Modified
This vulnerability has been modified since it was last analyzed by the NVD. It is awaiting reanalysis which may result in further changes to the information provided. Descriptionu'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55 Metrics
NVD enrichment efforts reference publicly available information to associate
vector strings. CVSS information contributed by other sources is also
displayed.
CVSS 4.0 Severity and Vector Strings:
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Known Affected Software Configurations Switch to CPE 2.2CPEs loading, please wait.
Denotes Vulnerable Software Quick InfoCVE Dictionary Entry:CVE-2020-11154 NVD Published Date: 11/02/2020 NVD Last Modified: 11/20/2024 Source: Qualcomm, Inc. |